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August 12 - 14, 2013
University of Minnesota, Minneapolis
NVMTS 2013 focuses on both emerging and existing non-volatile memory technologies instead of a singular technology, so as to encourage cross-pollenation of ideas. The aim of this conference is to gather top researchers in academia and industry as well as stakeholders and technologists to foster a free exchange of knowledge and achievements on a myriad of technologies. We aim to create a conducive environment for discussing various significant aspects of advanced memory technologies.
Follow the link below to view NVMTS 2013 conference materials.
To download your electronic copy of the NVMTS 2013 program, please click on the link below. Once you click it, a zip file containing the program will begin downloading on your computer.
The early registration deadline has been changed from July 22, 2013 to July 29, 2013. Please note that this means that you need to register before July 29. If you register on this date, you will be charged the late registration fee.
Full manuscripts will be peer-reviewed and go into the IEEE conference proceedings once accepted. Below is the template for you to use. Manuscripts should be sent to nvmts13@umn.edu by July 30, 2013. Please attach a signed copy of the IEEE copyright form. Proceedings will be submitted to IEEE.
→ Manuscript Template
There will be two best student presentation awards from NVMTS 2013. Each will be awarded $250 cash.
1. Best student presentation award of non volatile memory technologies.
2. Best student presentation award of non volatile memory materials.
There will be two student travel awards from NVMTS 2013. Each will be awarded with $400 to partially cover the conference travel and registration. The students who want to apply for this award should send their abstract and application letter to the conference by June 28, 2013.
If an invitation letter is needed for the visa application, please send an email to nvmts13@umn.edu.
The 13th Non-Volatile Memory Technology Symposium is sponsored by C-SPIN and technically co-sponsored by The University of Minnesota and IEEE Electron Devices Society.
