Dmitri Nikonov |
Intel |
USA |
Romney Katti |
Honeywell |
USA |
Akira Goda |
Micron Technology |
USA |
Behtash Behin-Aein |
GlobalFoundries |
USA |
Jean-Pierre Nozieres |
SPINTEC |
France |
Yukihiro Kaneko |
Panasonic Corporation |
Japan |
Alex Shukh |
Spingate Technology |
USA |
Jian-Ping Wang |
University of Minnesota |
USA |
Tetsuo Endoh |
Tohoku University |
Japan |
Dorothée Petit |
University of Cambridge |
UK |
Takahiro Hanyu |
Tohoku University |
Japan |
Andy Kent |
New York University |
USA |
Gabriel Molas |
Advanced Memory Technology and Innovative Device Laboratory, CEA-LETI-Minatec |
France |
Luping Shi |
Tsinghua University |
China |
Stephan Tappertzhofen |
Institute of Solid State Research |
Germany |
Dmitri Strukov |
University of California, Santa Barbara |
USA |
Xiufeng Han |
Institute of Physics, CAS |
China |
Jaakko Akola |
Tampere University of Technology |
Finland |
Akihito Sawa |
AIST, Japan |
Japan |
I-Wei Chen |
University of Pennsylvania |
USA |
Eilam Yalon |
Technion |
Israel |
Bin Yu |
State University of New York, Albany |
USA |
Gunuk Wang |
Rice University |
USA |
Ru Huang |
Peking University |
China |
Rong Zhao |
Singapore University of Technology and Design |
Singapore |
Kaushik Roy |
Purdue University |
USA |
Alexei Gruverman |
University of Nebraska-Lincoln |
USA |
Huaqiang Wu |
Tsinghua University |
China |
Shigemi Mizukami |
Tohoku University |
Japan |
Edwin Kan |
Cornell University |
USA |
Xiangshui Miao |
Hongzhong University of Science and Technology |
China |
Kang Wang |
University of California, Los Angeles |
USA |
ZhiTang Song |
Shanghai Institute of Microsystem and Information Technology, CAS |
China |
Christian Binek |
University of Nebraska |
USA |
James A. Bain |
Carnegie Mellon University |
USA |
Pete Eames |
NVE Technology |
USA |
Bin Ma |
Fudan University |
China |
Mahendra Pakala |
Appliedd Materials |
USA |
An Chen |
GlobalFoundries |
USA |
Wei-Gang Wang |
University of Arizona |
USA |