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High Speed Packaging Concepts for Optoelectronic Applications

Graduate Researcher: S. Riki Banerjee

     Combining the high-speed data communications with telecommunications technology requires new design methods that integrate RFIC designs used for electronic drive circuits with high data rate optoelectronic components.  A subsequent need is to develop advanced packaging methods that are complementary to chip-level electronic and photonic packaging.  The features of the integrated package design should offer integration capability of compact circuits onto high dielectric constant materials and leverage the advantage of low cost monolithic fabrication processes. 

     This work focuses on the development of suitable wideband interconnects for integrated packages.  Low dispersion is sought as well as approaches that minimize crosstalk between proximate signal lines.  A variety of micromachined configurations are being explored using traditional microstrip and coplanar architectures.  Interconnects in single or array designs are being studied in silicon optical microbench technology used in optoelectronic applications such as vertical cavity surface emitting lasers (VCSELs).  Integrated package designs based on the aforementioned configurations are also being investigated along with methods to improve high speed testing of electric signal lines. 

2/2003

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