[Up]

Books, Chapters and Invited Articles

·        L. P. B. Katehi, G. M. Rebeiz, T. M. Weller, R. F. Drayton, et, al., “Micromachined Circuits for Millimeter- and Sub-millimeter-Wave Applications,” IEEE Antennas and Propagation Maga­zine, vol.35, no.5, pp. 9-17, October 1993, invited paper.

·        R. F. Drayton, T. M. Weller, and L. P. B. Katehi, “Development and Characterization of Min­iaturized Circuits for High Frequency Applications Using Micromachining Techniques,” The International Journal of Microcircuits and Electronic Packaging, vol.18, no.13, p. 217-224, 1995, invited paper.

·        R. F. Drayton, The Development and Characterization of Self-Packages using Micromachin­ing Techniques for High Frequency Circuit Applications, Ph.D. Dissertation, University of Michigan, Ann Arbor, MI, 1995.

·        Co-author, Chapter 120, “Si micromachining in High Frequency Applications,” CRC Indus­trial Electronics Handbook edited by Dr. J. David Irvin, 1997.

·        J. Papapolymerou, R.F. Drayton and L.P.B. Katehi, “Surface-Wave Mode Reduction for Rect_angular Microstrip Antennas on High-Index Materials,” Directions for the Next Genera­tion of MMIC Devices and Systems, Plenum Publishing Corporation, New York, October 1997, pp. 153-160.

·        L. P.B. Katehi and R.F. Drayton, Chapter 13, “Micropackaging High-Density Radio Fre­quency/Microwave Circuits”, in Microengineering Aerospace Systems edited by Drs. Henry Helvajian, 1999.